Solder paste column M705, flux, board washing water with complete Liquor; board washing h2o is employed to scrub up the solder residue right after repair; thermal gel (specification: Fujipoly SPG-30B) is utilized to smear the floor in the chip immediately after repair ；ball-planting metal mesh, solder absorption wire, solder https://johnh382tjx5.wikicommunications.com/user