CMP, often called thermal oxidation polishing, makes use of MP in conjunction with chemicals to improve the MRR and make improvements to floor high-quality [20]. Determine two illustrates the schematic of an average CMP process [21]. The SiC wafer, which can be fastened within the provider, and the sprucing pad https://www.facebook.com/permalink.php?story_fbid=pfbid029kT26E6n65CKFZByyNUBaEos7Z945mDiUBh7mB9npCq1Yo84mBqcGX4M4vCkRLQ8l&id=61562415773754&__cft__[0]=AZUzbmU6oo4Alv_FkxFrx8tEilC_-sMe382neHSlGnKOL6-yNWWlsboQkzyrQTF5ZneIvsHO8XAOBP0VqYc16xJnxDmbRb9sqQE-IVi9X5DQ-QyiGVa8-d5tGhbsLrvK2lUN64t2AbYC0RoW1R2LF7hbFV0ctO9z85mUBj58H7mxwBTu_8TrrW4DLtC86YZX3zKSRqkhCN5eItBGPBBZVHBw&__tn__=%2CO%2CP-R